Durable connectors for real life test and measurement applications.
Challenge:
Years ago, it was merely science fiction to be able to not only send text wirelessly but also to send images, videos and large data packages. At the heart of these devices are semiconductors. Over the years, the industry has demanded more reliable semiconductors and at the same time, they have grown more complex. The combination of these two factors has put great emphasis on the need to ensure trouble-free operation over a long period. Testing of these semiconductors provides valuable insight into causes of failure, which in turn lead to improvements in the design of the semiconductor which then helps to improve the overall reliability of the wireless device.
Thermal over-stress, or excess heat, can cause semiconductors within wireless devices to fail. Excess heat melts materials and warps and breaks semiconductor dies. In general, semiconductors should not operate with a junction temperature above 125–150°C.
A heat test, or temperature test, is used to test the temperature sensitivity on all semiconductors during the research and development and production stages in the life of the semiconductor. Customers face challenges in producing accurate results while performing temperature testing of semiconductors. Concerns arise from insuring how radiant heat loss is kept to a minimum within the chamber, as well as making sure that the connector carrying the signal from within the heat chamber is durable enough to withstand the constantly high temperatures.
One of the other challenges, specific to this customer, is the high quantity of temperature test stations that were needed (300-400 per year) and their ability to produce the cabling for that many with the man power on staff.
Solution:
With its durable and rugged design, MAC Panel’s APEX connector was selected as the connector of choice for this customer’s application.
APEX boasts a rugged design with a strong military grade aluminum back shell and with the use of G10 (high-pressure fiberglass laminate) as the material used for the module plug and socket. This rugged design allowed for the customer to use it within their temperature testing chambers without worry of failure.
Also, MAC Panel’s wiring services were selected to help with the production of all APEX cables coming from the test station and into the temperature chambers.
MAC Panel’s IPC certified technicians produce the 300-400 cables a year to the customer’s demanding quality standards specified by the test architecture.
Solution Overview:
Customer Profile
Fortune 500 global semiconductor company that designs and manufactures radio frequency systems for applications within the wireless, broadband communications, and foundry services.
Challenges
- With the uptick in the wireless and communications market the customer was struggling to keep up with the demand of producing a cabled connection to temp chambers that could withstand the temperatures set by the test parameters (usually 125 degrees C +) in the quantities needed (300-400 per year).
Solutions
- The APEX connector was used due to its extreme durability.
- MAC Panel’s wiring services was chosen to produce the high quantity cables needed.
Value Created
- Allowed the customer to standardize on a connector solution for temp chambers on all product lines.
- MAC Panel’s in-house wiring capabilities allowed customer to be hands-off with this portion of the test builds, worry free.
APEX Connectors
The APEX connector was used due to its extreme durability.
Wiring Service
Wiring Services
MAC Panel’s wiring services was chosen to produce the high quantity cables needed.
Complete Solution
MAC Panel’s IPC certified technicians produce the 300-400 cables a year to the customer’s demanding quality standards specified by the test architecture.
Value Created
Utilizing the APEX connector and MAC Panel’s wiring services, the customer can perform temperature testing, worry free, for their line of semiconductors. MAC Panel’s total package solution (APEX connector and wiring services) has also allowed for the standardization of the temperature test station design across all semiconductor lines allowing for global deployment of these test stations to other customer facilities which reduces the number of vendors and man hours involved in the product of such testing stations which has provided huge overall cost savings to the customer.